The NDAA compliant and ITAR free Hadron™ 640 series pairs a 64MP visible camera with a performance-leading 640x512 resolution radiometric Boson® or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications utilizing Teledyne FLIR Prism™ software.
Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 also reduces development cost and shortens time to market.
Evaluate Prism with the Hadron 640R using the Prism Development Kit for Qualcomm RB5 today.
- Products
- OEM Cameras, Components, and Lasers
- Infrared Camera Cores & Lenses
- LWIR
- Hadron™ 640 Series
Added to cart
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Industry-Leading Thermal and Visible Camera Performance
Collect high-speed, VGA radiometric thermal and HD visible imagery.
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Built for Integrators
Reduce development cost and time to market with solution from a single, reliable supplier.
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Size, Weight, and Power (SWaP) Optimized Design
Optimize design and operation time with compact, lightweight, and low-power module.
Teal 2 sUAS Overview feat. Hadron 640R
Traffic Surveillance with Hadron 640R
Getting Started with NVIDIA Jetson Nano & FLIR Hadron 640R
Getting Started with Qualcomm RB5 and FLIR Hadron 640R
Specifications
- Thermal Imaging Detector
- Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Radiometric
- Temperature Accuracy
- ±5 °C less, over 0 °C to 100 °C range
Radiometry
- Temperature Accuracy
- ±5 °C less, over 0 °C to 100 °C range
Imaging & Optical
- EO Camera Optics
- Kontatsu B0623D01-0, EFL 4.8mm, 67° HFOV, F/# 1/2.3
- EO Camera Sensor
- 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
- EO Camera Video
- Full resolution @ 60 Hz
- IMU
- ICM20602, I2C or SPI (selectable)
- IR Camera Optics
- EFL 13.6mm, 32° HFOV, F/# 1.0
- IR Camera Video
- Full resolution @ 60Hz
- Sensitivity [NEdT]
- <20 mK
- Thermal Imaging Detector
- Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Radiometric
Connections & Communications
- Software Drivers
- for NVIDIA Jetson Nano
for Qualcomm Snapdragon RB5
for Qualcomm Snapdrago 865
Electrical
- Electrical Interface
- Hadron connector: Hirose DF40C-50DP-0.4V(51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V(51)
- Power Consumption
- 5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW
Mechanical
- Mechanical Interface
- Screw mount to back plate
- Size (L x W x H)
- 35 x 49 x 45 mm
- Weight
- 56g
Environmental & Approvals
- Compliance and Certifications
- NDAA compliant
- Environmental Sealing
- IP54 (with the rear interfaces sealed)
- Operational & Storage Temperature
- -20°C to +60°C
- Tested EMI Performance
- FCC part 15 Class B
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Related Documents
Export Restrictions
Export Restrictions
The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.